• DocumentCode
    3565911
  • Title

    Thermoelectric waste heat recovery for automotive

  • Author

    Chun-Kai Liu ; Wei-Kuo Han ; Hsieh-Chun Hsieh

  • Author_Institution
    Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • fYear
    2014
  • Firstpage
    57
  • Lastpage
    60
  • Abstract
    Approximate 70% of the energy generated by the combustion of fuel in IC engine cannot be converted into mechanical energy, but disperses to the environment as waste heat. Reduction of energy consumption and curb of CO2 emissions of automotive becomes an important issue. The thermoelectric technology can convert heat into electric energy and improve the fuel efficiency of automotive. It has attracted wide attention. This paper studies the thermoelectric waste heat recovery system for automotive. 20 thermoelectric devices are attached to the exhaust pipe to convert waste heat to electrical energy. The heat from cold side of thermoelectric devices is removed by liquid-cooling cold plate. We design the heat exchanger of exhaust pipe to harvest heat of exhaust gas to thermoelectric modules effectively. The performance of thermoelectric waste heat recovery system with different designs is comprehensively studied. It is shown that the optimum design of heat exchanger can improve heat interception from exhaust pipe and improve the output power of thermoelectric devices.
  • Keywords
    automobiles; combustion; cooling; environmental economics; exhaust systems; heat exchangers; heat recovery; pipes; power consumption; thermoelectric devices; waste heat; CO2; automotive; carbon dioxide emissions; electric energy; energy consumption; exhaust pipe; fuel combustion; fuel efficiency; heat exchanger; liquid-cooling cold plate; thermoelectric devices; thermoelectric modules; thermoelectric waste heat recovery; Heat engines; Heat recovery; Heat transfer; Surface waves; Thermoelectric devices; Waste heat;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
  • Type

    conf

  • DOI
    10.1109/IMPACT.2014.7048422
  • Filename
    7048422