• DocumentCode
    3567015
  • Title

    High-Throughput, Multi-Function, On-Wafer Test System

  • Author

    Lewis, Gary ; Sweeney, Roger ; Lorch, Phil ; McAleenan, Roger ; Hewitt, Gary ; Semones, Tim

  • Author_Institution
    ITT Gallium Arsenide Technology Center, Roanoke, VA
  • Volume
    15
  • fYear
    1989
  • Firstpage
    67
  • Lastpage
    75
  • Abstract
    analyzing and solving numerous hardware and software test issues, and it requires a thorough knowledge of the entire test environment. The most effective way to address the variety of issues is to create a partnership between several companies (hardware and software vendors and end users). In this spirit, ITT, HP, IMS and Cascade are working together to create an on-wafer RF test environment which addresses high throughput, low cost military test needs. HP is chartered with developing the test system hardware, Cascaded is chartered with developing the test executive software (test plan editor, probe plan editor, display utilities, etc.), IMS is chartered with developing the software measurement modules (S Parameters, NF, PldB, etc.), and ITT will integrate and evaluate the entire system. The objective of our efforts is to create a software reconfigureable, high throughput, on-wafer test system that can characterize all MMICs (including power amplifier ICs) at the lowest possible per unit test cost.
  • Keywords
    Costs; Hardware; Instruments; MMICs; Radio frequency; Scattering parameters; Software measurement; Software testing; System testing; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 33rd
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1989.323939
  • Filename
    4119505