DocumentCode :
3567015
Title :
High-Throughput, Multi-Function, On-Wafer Test System
Author :
Lewis, Gary ; Sweeney, Roger ; Lorch, Phil ; McAleenan, Roger ; Hewitt, Gary ; Semones, Tim
Author_Institution :
ITT Gallium Arsenide Technology Center, Roanoke, VA
Volume :
15
fYear :
1989
Firstpage :
67
Lastpage :
75
Abstract :
analyzing and solving numerous hardware and software test issues, and it requires a thorough knowledge of the entire test environment. The most effective way to address the variety of issues is to create a partnership between several companies (hardware and software vendors and end users). In this spirit, ITT, HP, IMS and Cascade are working together to create an on-wafer RF test environment which addresses high throughput, low cost military test needs. HP is chartered with developing the test system hardware, Cascaded is chartered with developing the test executive software (test plan editor, probe plan editor, display utilities, etc.), IMS is chartered with developing the software measurement modules (S Parameters, NF, PldB, etc.), and ITT will integrate and evaluate the entire system. The objective of our efforts is to create a software reconfigureable, high throughput, on-wafer test system that can characterize all MMICs (including power amplifier ICs) at the lowest possible per unit test cost.
Keywords :
Costs; Hardware; Instruments; MMICs; Radio frequency; Scattering parameters; Software measurement; Software testing; System testing; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ARFTG Conference Digest-Spring, 33rd
Print_ISBN :
0-7803-5686-1
Type :
conf
DOI :
10.1109/ARFTG.1989.323939
Filename :
4119505
Link To Document :
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