Title :
Constitutive and damage model for solders
Author :
Stolkarts, V. ; Moran, B. ; Keer, L.M.
Author_Institution :
Northwestern Univ., Evanston, IL, USA
Abstract :
A unified creep-plasticity model with damage is introduced and employed to simulate the isothermal cyclic behavior of Sn-Ag solder. The proposed damage evolution law is based on a nonlinear accumulation of damage and an interaction between applied load and creep. The stress drop amplitude and hysteresis loops are modeled over a wide range of loading conditions
Keywords :
creep; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; plasticity; silver alloys; soldering; tin alloys; SnAg; applied load; constitutive model; creep-plasticity model; damage evolution law; damage model; hysteresis loops; interconnect failure; isothermal cyclic behavior; joint reliability; loading conditions; nonlinear accumulation; solders; stress drop amplitude; Capacitive sensors; Creep; Fatigue; Isothermal processes; Semiconductor materials; Soldering; Temperature; Testing; Thermal expansion; Thermal loading;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678721
