• DocumentCode
    3567108
  • Title

    Testing a complete control and protection system for multi-terminal MMC HVDC links using hardware-in-the-loop simulation

  • Author

    Zhe Zhu ; Xiaolin Li ; Hong Rao ; Weihua Wang ; Wei Li

  • Author_Institution
    Electr. Power Res. Inst., China Southern Power Grid, Guangzhou, China
  • fYear
    2014
  • Firstpage
    4402
  • Lastpage
    4408
  • Abstract
    This paper presents the dynamic performance test of a complete control and protection system for a Multi-terminal MMC HVDC system using hardware-in-the-loop (HIL) simulation. A novel HIL bench with a cost-effective input and output interface between the control system under test and the real-time simulator is introduced. Two critical test cases, namely the start-up of the MMC connected to islanded networks and the AC fault in the bus close to the MMC substation are studied. The validity of the proposed methodology for the dynamic performance test is confirmed by comparing the results from the HIL test and the actual waveform recorded from the field, after the MMC is commissioned.
  • Keywords
    HVDC power transmission; distributed power generation; electricity supply industry; power system simulation; power transmission faults; power transmission protection; substation protection; AC fault; HIL simulation; HVDC transmissions; MMC substation; complete control system; complete protection system; control system-under-test; cost-effective input interface; cost-effective output interface; dynamic performance test; electric power industry; hardware-in-the-loop simulation; islanded networks; multiterminal MMC HVDC links; multiterminal MMC HVDC system; real-time simulator; Control systems; Field programmable gate arrays; HVDC transmission; Real-time systems; Valves; Voltage control; Voltage measurement; Hardware-in-the-loop(HIL); Modular Multilevel Converter (MMC); Multi-terminal HVDC; RT-LAB;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, IECON 2014 - 40th Annual Conference of the IEEE
  • Type

    conf

  • DOI
    10.1109/IECON.2014.7049165
  • Filename
    7049165