• DocumentCode
    3567675
  • Title

    Surface acoustic waves as a technique for in-line detection of processing damage to low-k dielectrics

  • Author

    Iacopi, F. ; Brongersma, S.H. ; Mazurenko, A. ; Struyf, H. ; Mannaert, G. ; Travaly, Y. ; Maznev, A. ; Abell, T.J. ; Tower, J. ; Maex, K.

  • Author_Institution
    IMEC, Leuven, Belgium
  • fYear
    2005
  • Firstpage
    217
  • Lastpage
    219
  • Abstract
    A surface acoustic wave technique was successfully applied for monitoring modification/damage of low-k dielectrics resulting from plasma-based patterning in a non-destructive and non-contact fashion. It is shown that this technique can be used to assess and compare dielectric damage, due to different processing conditions, in patterned structures.
  • Keywords
    acoustic applications; dielectric thin films; integrated circuit technology; integrated circuit testing; surface acoustic waves; dielectric damage; in-line processing damage detection; integrated structures; low-k dielectrics; low-k films; patterned structures; plasma-based patterning; surface acoustic wave technique; Acoustic signal detection; Acoustic waves; Ash; Dielectrics; Plasma applications; Plasma density; Plasma materials processing; Plasma measurements; Sawing machines; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International
  • Print_ISBN
    0-7803-8752-X
  • Type

    conf

  • DOI
    10.1109/IITC.2005.1499988
  • Filename
    1499988
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3567675