• DocumentCode
    3567730
  • Title

    Quantitative electrically detected magnetic resonance for device reliability studies

  • Author

    Cochrane, Corey J. ; Anders, Mark ; Mutch, Mike ; Lenahan, Patrick

  • Author_Institution
    Microdevices Lab., NASA´s Jet Propulsion Lab., Pasadena, CA, USA
  • fYear
    2014
  • Firstpage
    6
  • Lastpage
    9
  • Abstract
    Electrically detected magnetic resonance (EDMR) is a valuable tool for studying a variety of reliability problems, including the negative-bias temperature instability, total ionizing dose radiation damage, and instability in high-K gate stack-based MOS devices. Although conventional high-field EDMR can provide identification of the physical and chemical nature of electrically active reliability dominating defects in microelectronic devices, all of the EDMR studies to date have been limited by one significant shortcoming: EDMR is not quantitative. Although a large EDMR response generally corresponds to a high defect density and a small EDMR response corresponds to a low one, it has not been possible to assign actual numbers to the defect densities detected via EDMR. We´ve solved this problem.
  • Keywords
    MOSFET; high-k dielectric thin films; magnetic resonance; negative bias temperature instability; radiation hardening (electronics); semiconductor device reliability; EDMR; defect density; device reliability problem; electrically active reliability dominating defects; high-K gate stack-based MOS devices; microelectronic devices; negative-bias temperature instability; pMOSFET devices; quantitative electrically detected magnetic resonance; total ionizing dose radiation damage; Density measurement; Dielectric measurement; Dielectrics; Frequency measurement; Magnetic resonance; Reliability; Silicon carbide; defect density measurement; electrically detected magnetic resonance; spin dependent recombination; spin dependent tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
  • Print_ISBN
    978-1-4799-7308-8
  • Type

    conf

  • DOI
    10.1109/IIRW.2014.7049495
  • Filename
    7049495