DocumentCode :
3567730
Title :
Quantitative electrically detected magnetic resonance for device reliability studies
Author :
Cochrane, Corey J. ; Anders, Mark ; Mutch, Mike ; Lenahan, Patrick
Author_Institution :
Microdevices Lab., NASA´s Jet Propulsion Lab., Pasadena, CA, USA
fYear :
2014
Firstpage :
6
Lastpage :
9
Abstract :
Electrically detected magnetic resonance (EDMR) is a valuable tool for studying a variety of reliability problems, including the negative-bias temperature instability, total ionizing dose radiation damage, and instability in high-K gate stack-based MOS devices. Although conventional high-field EDMR can provide identification of the physical and chemical nature of electrically active reliability dominating defects in microelectronic devices, all of the EDMR studies to date have been limited by one significant shortcoming: EDMR is not quantitative. Although a large EDMR response generally corresponds to a high defect density and a small EDMR response corresponds to a low one, it has not been possible to assign actual numbers to the defect densities detected via EDMR. We´ve solved this problem.
Keywords :
MOSFET; high-k dielectric thin films; magnetic resonance; negative bias temperature instability; radiation hardening (electronics); semiconductor device reliability; EDMR; defect density; device reliability problem; electrically active reliability dominating defects; high-K gate stack-based MOS devices; microelectronic devices; negative-bias temperature instability; pMOSFET devices; quantitative electrically detected magnetic resonance; total ionizing dose radiation damage; Density measurement; Dielectric measurement; Dielectrics; Frequency measurement; Magnetic resonance; Reliability; Silicon carbide; defect density measurement; electrically detected magnetic resonance; spin dependent recombination; spin dependent tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
Print_ISBN :
978-1-4799-7308-8
Type :
conf
DOI :
10.1109/IIRW.2014.7049495
Filename :
7049495
Link To Document :
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