• DocumentCode
    3567752
  • Title

    Influence of nitrogen trap states on the electronic properties of high-k metal gate transistors

  • Author

    Ocker, J. ; Kupke, S. ; Slesazeck, S. ; Mikolajick, T. ; Erben, E. ; Drescher, M. ; Naumann, A. ; Lazarevic, F. ; Leitsmann, R.

  • Author_Institution
    NaMLab gGmbH, Dresden, Germany
  • fYear
    2014
  • Firstpage
    86
  • Lastpage
    89
  • Abstract
    The origin of the defects associated with the nitridation of the interface layer between Si and HfO2 is investigated. The electronic properties change upon nitridation which impact severely the gate capacitance and gate leakage current. We modeled the temperature-dependent leakage current in SiON/HfO2 gate dielectrics for positive and negative gate voltages by means of a multi-phonon trap-assisted tunneling scheme to extract the trap distribution. The results are supported by charge pumping measurements and simulation. To clarify the origin of the additional traps in the SiON interface we performed ab-initio calculation and correlated the results with the gate leakage current measurements. Finally, we shed new light on the relation between stress-induced leakage current and positive bias temperature instability.
  • Keywords
    ab initio calculations; hafnium compounds; nitridation; nitrogen; oxygen compounds; silicon compounds; transistors; tunnelling; N; SiON-HfO2; ab-initio calculation; electronic properties; gate capacitance; gate dielectrics; gate leakage current; high-k metal gate transistors; multi-phonon trap-assisted tunneling; negative gate voltages; nitridation; positive bias temperature instability; positive gate voltages; stress-induced leakage current; trap distribution; trap states; Dielectrics; Electron traps; Hafnium compounds; Leakage currents; Logic gates; Nitrogen; Tunneling; Charge Pumping; Gate Leakage; High-k Metal Gate Dielectric; Interfacial Layer; Stress-Induced Leakage Current;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
  • Print_ISBN
    978-1-4799-7308-8
  • Type

    conf

  • DOI
    10.1109/IIRW.2014.7049517
  • Filename
    7049517