DocumentCode :
3567765
Title :
Comparison of duty-cycle effects at room temperature in SiON and HfO2 gate PMOS FETS
Author :
Nguyen, D.D. ; Kouhestani, C. ; Kambour, K.E. ; Bersuker, G. ; Devine, R.A.B.
Author_Institution :
COSMIAC, Albuquerque, NM, USA
fYear :
2014
Firstpage :
143
Lastpage :
146
Abstract :
The existence of multiple, physically distinct components of Negative Bias Temperature Instability requires a measurement methodology which allows the extraction of each component independently. In this paper we present results obtained at room temperature, which minimizes both the interface state and switching trap components, allowing us to explore the trapping of holes at preexisting defects in the oxide. This is done for both SiON and HfO2/SiO2 oxide stacks of similar total thickness. Results are presented for both pseudo-DC and pulse stressing including the dependence of the pulse measurements on duty cycle. A two trap model using the Tewksbury formalism is proposed to predict the results.
Keywords :
MOSFET; hafnium compounds; oxygen compounds; semiconductor device reliability; silicon compounds; HfO2-SiO2; PMOS FETS; SiON; Tewksbury formalism; duty-cycle effects; interface state; negative bias temperature instability; pulse measurements; switching trap components; temperature 293 K to 298 K; Hafnium compounds; Logic gates; Semiconductor device measurement; Stress; Temperature measurement; Threshold voltage; Voltage measurement; NBTI; oxide traps; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report (IIRW), 2014 IEEE International
Print_ISBN :
978-1-4799-7308-8
Type :
conf
DOI :
10.1109/IIRW.2014.7049531
Filename :
7049531
Link To Document :
بازگشت