DocumentCode :
3567978
Title :
Tanδ temperature spectroscopy of mica tape binder
Author :
Huang, Zhiguo
Author_Institution :
Wuhan Ship Electron. Propulsion Inst. of CSS, Hubei, China
fYear :
1994
Firstpage :
216
Lastpage :
220
Abstract :
For the past few decades, the design trend for high voltage rotating machinery has been toward greater capacity, longer service life, more reliable operation, and higher voltage levels. Two kinds of insulation system have been applied: the vacuum pressure impregnation (VPI) and the rich resins. Although the VPI insulation system has good properties, the rich resin binders are still being paid wide attention. This paper describes the dissipation factor temperature spectroscopy for several kinds of rich resin micapaper tape binders being used in China. Changes of tanδ of epoxies cured with Tung oil anhydride, modified bismaleimide and metal carboxylate are different. With adding modified bismaleimide the heat resistance of the binder is improved. Tanδ is high when using metal carboxylate at high temperature. By reducing dosage and improving reaction activity tanδ will be a low value at high temperature. The epoxy resins discussed in this paper are bisphenol A epoxy E44 and novolac epoxy resin F44 produced in China. The values of tanδ are obtained at 1 kV and 50 Hz
Keywords :
dielectric losses; 1 kV; 50 Hz; China; Tung oil anhydride; bisphenol A epoxy E44; dissipation factor; epoxy resins; heat resistance; high voltage rotating machinery; insulation system; metal carboxylate; mica tape binder; modified bismaleimide; novolac epoxy resin F44; reaction activity; rich resin micapaper tape binders; tanδ temperature spectroscopy; Epoxy resins; Insulation; Lead; Machinery; Marine vehicles; Petroleum; Propulsion; Spectroscopy; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1994., IEEE 1994 Annual Report., Conference on
Print_ISBN :
0-7803-1950-8
Type :
conf
DOI :
10.1109/CEIDP.1994.591744
Filename :
591744
Link To Document :
بازگشت