Title :
Numerical analysis of an array of ball grid components
Author :
Cole, Reena ; Davies, Mark
Author_Institution :
Stokes Res. Inst., Limerick Univ., Ireland
fDate :
6/24/1905 12:00:00 AM
Abstract :
Numerical modeling is a valuable analysis tool, however it is still a time consuming process and it is imperative that models be validated. The authors have proposed an alternative to full-scale numerical modeling as a first level design tool, which involves the use aerodynamic and thermal influence factors. Cole et al. [2001] presented a ball grid array (BGA) test apparatus, and also presented aerodynamic measurements made using particle image velocimetry (PIV). Part II of that paper presented thermal resistance measurements, influence factors calculated, and infrared images of surface temperatures. This paper presents numerical models made with an industry standard computational fluid dynamics (CFD) package, using the benchmark data provided from the previous work. The objective is to validate the numerical models, in order to be able to examine additional geometries.
Keywords :
aerodynamics; ball grid arrays; computational fluid dynamics; integrated circuit packaging; thermal conductivity; thermal resistance; aerodynamic factors; ball grid component array; benchmark data; computational fluid dynamics; first level design tool; full-scale numerical modeling; numerical models; particle image velocimetry; thermal conductivity; thermal influence factors; thermal resistance; Aerodynamics; Computational fluid dynamics; Electrical resistance measurement; Electronics packaging; Numerical analysis; Numerical models; Particle measurements; Testing; Thermal factors; Thermal resistance;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
Print_ISBN :
0-7803-7152-6
DOI :
10.1109/ITHERM.2002.1012439