DocumentCode :
3568278
Title :
Fatigue failure types of the conducting polythiophene thin film on the stainless substrate
Author :
Wang, Xishu ; Zhu, Suiqun ; Zhang, Jiaxin ; Shi, Gaoquan
Author_Institution :
Dept. of Eng. Mech., Tsinghua Univ., Beijing, China
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
658
Lastpage :
662
Abstract :
Conducting polymer films have been widely used as the small size and lightweight materials for electronic parts, sensors and semiconductors. For reliability of these parts, it is particularly necessary to know the fatigue fracture behavior of the thin film. In this paper, a new fatigue testing method was developed by which fatigue failure on the surface deposited by the electrochemical synthesis on the base of the 304 stainless steel plate under the cyclic tension-tension loading. The fatigue tests were investigated by the stochastic observation method with Scanning Electron Microscopy (SEM). The experimental results show that the fatigue fracture types of the conducting polythiophene thin film on the substrate, through which the nucleation of fatigue microcrack and propagation as well as fatigue embattlement process can be expressed by experimental approach. Additionally, detailed analysis is introduced through observation with SEM and the effects on the results of testing conditions are discussed in this paper.
Keywords :
conducting polymers; fatigue cracks; fatigue testing; microcracks; polymer films; scanning electron microscopy; 304 stainless steel plate substrate; conducting polymer; cyclic tension-tension loading; electrochemical synthesis; electronic material; fatigue embattlement; fatigue failure; fatigue fracture; fatigue testing; microcrack nucleation; polythiophene thin film; scanning electron microscopy; stochastic observation; Conducting materials; Fatigue; Polymer films; Scanning electron microscopy; Semiconductor materials; Semiconductor thin films; Substrates; Surface cracks; Testing; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN :
1089-9870
Print_ISBN :
0-7803-7152-6
Type :
conf
DOI :
10.1109/ITHERM.2002.1012517
Filename :
1012517
Link To Document :
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