• DocumentCode
    3568278
  • Title

    Fatigue failure types of the conducting polythiophene thin film on the stainless substrate

  • Author

    Wang, Xishu ; Zhu, Suiqun ; Zhang, Jiaxin ; Shi, Gaoquan

  • Author_Institution
    Dept. of Eng. Mech., Tsinghua Univ., Beijing, China
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    658
  • Lastpage
    662
  • Abstract
    Conducting polymer films have been widely used as the small size and lightweight materials for electronic parts, sensors and semiconductors. For reliability of these parts, it is particularly necessary to know the fatigue fracture behavior of the thin film. In this paper, a new fatigue testing method was developed by which fatigue failure on the surface deposited by the electrochemical synthesis on the base of the 304 stainless steel plate under the cyclic tension-tension loading. The fatigue tests were investigated by the stochastic observation method with Scanning Electron Microscopy (SEM). The experimental results show that the fatigue fracture types of the conducting polythiophene thin film on the substrate, through which the nucleation of fatigue microcrack and propagation as well as fatigue embattlement process can be expressed by experimental approach. Additionally, detailed analysis is introduced through observation with SEM and the effects on the results of testing conditions are discussed in this paper.
  • Keywords
    conducting polymers; fatigue cracks; fatigue testing; microcracks; polymer films; scanning electron microscopy; 304 stainless steel plate substrate; conducting polymer; cyclic tension-tension loading; electrochemical synthesis; electronic material; fatigue embattlement; fatigue failure; fatigue fracture; fatigue testing; microcrack nucleation; polythiophene thin film; scanning electron microscopy; stochastic observation; Conducting materials; Fatigue; Polymer films; Scanning electron microscopy; Semiconductor materials; Semiconductor thin films; Substrates; Surface cracks; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-7152-6
  • Type

    conf

  • DOI
    10.1109/ITHERM.2002.1012517
  • Filename
    1012517