DocumentCode
3568619
Title
A fully integrated Doherty-amplifier for 5.6 GHz WLAN applications
Author
Tzschoppe, Christoph ; Wolf, Robert ; Fritsche, David ; Richter, Alexander ; Ellinger, Frank
fYear
2014
Firstpage
72
Lastpage
75
Abstract
In this paper, a fully integrated Doherty power amplifier (DPA) for application in IEEE 802.11a wireless local area network (WLAN) transmitters is proposed. The DPA exhibits an output power at its 1 dB compression point of 22 dBm with a corresponding power added efficieny (PAE) of 25 %. Within a 6dB-backoff the PAE is still 20 %, which among the highest reported for Doherty amplifiers fully integrated in silicon. The input reflection coefficient is less than -15 dB while the maximum forward transmission is 12.5 dB. This Doherty amplifier shows a low phase variation of only 16° over an input dynamic range of 30 dB. To verify the performance the DPA is measured with an orthogonal frequency divison multiplexed (OFDM) signal with 52 carriers using 16 QAM modulation scheme and a carrier frequency of 5.6 GHz. Error vector magnitudes are measured for different input power levels. The circuit is implemented in IHP 250nm-SiGe-BiCMOS technology and needs a 2.5 V supply. The chip area is 1.54 mm2 × 0.85 mm2 including the pads and eleven integrated inductors.
Keywords
BiCMOS integrated circuits; OFDM modulation; radio transmitters; radiofrequency power amplifiers; wireless LAN; 16 QAM modulation scheme; BiCMOS technology; DPA; Doherty power amplifier; IEEE 802.11a wireless local area network transmitters; IHP; OFDM; PAE; SiGe; WLAN applications; frequency 5.6 GHz; integrated inductors; orthogonal frequency divison multiplexed; power added efficieny; reflection coefficient; size 0.85 mm; size 1.54 mm; size 250 nm; voltage 2.5 V; Frequency measurement; Impedance; OFDM; Power generation; Semiconductor device measurement; Vectors; Wireless LAN; BiCMOS integrated circuits; OFDM; Peak to average power ratio; Power amplifiers; Wireless LAN;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits and Systems (ICECS), 2014 21st IEEE International Conference on
Type
conf
DOI
10.1109/ICECS.2014.7049924
Filename
7049924
Link To Document