Investigation on bond wire dedicated to integrated time base

Author

Gamet, Amaud ; Meillere, Stephane ; Bendahan, Marc ; Le Fevre, Philippe ; Froidevaux, Nicolas

Author_Institution

IM2NP, Aix-Marseille Univ., Marseille, France

fYear

2014

Firstpage

227

Lastpage

230

Abstract

This paper presents an investigation work about the bond wire electrical performances, with the aim of designing an integrated time base using the bond wire inductance. Our work was focused on the characterization of single and double gold bond wire, and multi bond wire length for the frequency range from 500 MHz to 5 GHz. A lumped n-model is used for the modeling and the electrical parameters are extracted thanks to the measured S-parameters. A de-embedding procedure is performed to characterize the bond wire. Finally, a structure is proposed to employ the bond wire into an integrated time base.

Keywords

S-parameters; gold; integrated circuit interconnections; lead bonding; lumped parameter networks; S-parameter; bond wire electrical performance; bond wire inductance; deembedding procedure; electrical parameter; frequency 500 MHz to 5 GHz; gold bond wire; integrated time base; lumped II-model; multibond wire length; Frequency measurement; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Oscillators; Wires; Interconnections; S-parameters; bond wire; integrated time base; oscillators; resonance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Circuits and Systems (ICECS), 2014 21st IEEE International Conference on

Type

conf

DOI

10.1109/ICECS.2014.7049963

Filename

7049963