Title :
A physical model for the transient response of capacitively loaded distributed RLC interconnects
Author :
Venkatesan, Raguraman ; Davis, Jeffrey A. ; Meindl, James D.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
Rapid approximation of the transient response of high-speed global interconnects is needed to estimate the time delay, crosstalk, and overshoot in a GSI multilevel wiring network. This paper outlines a rigorous and physical solution for transients in a capacitively-loaded distributed RLC interconnect using a convergent series of modified Bessel functions. Compact models for time delay and repeater insertion are derived. The single-line model is extended to evaluate crosstalk in two-coupled lines. These solutions are validated by HSPICE simulation, and have potential applications to rapid RLC timing analysis, global wire sizing and repeater insertion, signal integrity estimation, and reliability modeling (e.g. voltage overshoot and high current density concerns).
Keywords :
Bessel functions; RLC circuits; SPICE; ULSI; crosstalk; delays; high-speed integrated circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; repeaters; timing; transient response; GSI multilevel wiring network; HSPICE simulation; capacitively loaded distributed RLC interconnects; crosstalk; global wire sizing; high current density concerns; high-speed global interconnects; modified Bessel functions; overshoot; physical model; rapid RLC timing analysis; reliability modeling; repeater insertion; signal integrity estimation; single-line model; time delay; transient response; two-coupled lines; voltage overshoot; Analytical models; Crosstalk; Delay effects; Delay estimation; Repeaters; Signal analysis; Timing; Transient response; Wire; Wiring;
Conference_Titel :
Design Automation Conference, 2002. Proceedings. 39th
Print_ISBN :
1-58113-461-4
DOI :
10.1109/DAC.2002.1012725