Analyzing the electromigration effects on different metal layers and different wire lengths

Electromigration (EM) is a significant problem in integrated circuits and can seriously damage interconnect wires and vias, reducing the circuit´s lifetime. In this paper we are simulating the EM effects on 6 different metal layers for different wire lengths incorporating Joule heating effects. The layouts are constructed considering the 45nm technology and scaled to 22nm technology. We are simulating the EM effects considering three different wire lengths, 100μm, 200μm and 300μm in 22nm technology for a reference frequency of 2GHz. The delay is also analyzed and it increases when the wire length increases and decreases for a higher metal layer.