• DocumentCode
    3569274
  • Title

    UVM-SystemC-AMS based framework for the correct by construction design of MEMS in their real heterogeneous application context

  • Author

    Machne, Torsten ; Zhi Wang ; Vernay, Benoit ; Andrade, Liliana ; Ben Aoun, Cedric ; Chaput, Jean-Paul ; Louerat, Marie-Minerve ; Pecheux, Francois ; Krust, Arnaud ; Schropfer, Gerold ; Barnasconi, Martin ; Einwich, Karsten ; Cenni, Fabio ; Guillaume, Oliv

  • Author_Institution
    LIP6, Sorbonne Univ., Paris, France
  • fYear
    2014
  • Firstpage
    862
  • Lastpage
    865
  • Abstract
    Each new embedded system tends to integrate more sensors with tight software-driven control, digitally assisted analog circuits, and heterogeneous structure. A more responsive simulation environment is needed to support the co-design and verification of such complex architectures including all its digital hardware/software and analog/multi-physical aspects using Multi-Disciplinary Virtual Prototyping (MDVP). Taking a Micro-Electro-Mechanical System (MEMS) vibration sensor as an example, we introduce a reusable framework based on the state-of-the-art technologies SystemC AMS, Finite Elements/Reduced-Order modeling, and UVM to design, simulate, and verify such systems in their real application context.
  • Keywords
    embedded systems; microsensors; vibrations; virtual prototyping; MEMS vibration sensor; UVM-SystemC-AMS based framework; complex architectures; embedded system; heterogeneous application context; multidisciplinary virtual prototyping; Integrated circuit modeling; Micromechanical devices; Sensor systems; Solid modeling; Vibrations; Virtual prototyping; Micro-Electro-Mechanical System (MEMS); Multi-Disciplinary Virtual Prototyping (MDVP); SystemC AMS; Universal Verification Methodology (UVM); bond graph formalism; design and verification methodology; dimensional analysis; reduced-order modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Circuits and Systems (ICECS), 2014 21st IEEE International Conference on
  • Type

    conf

  • DOI
    10.1109/ICECS.2014.7050122
  • Filename
    7050122