• DocumentCode
    3569281
  • Title

    The impact of routing arbitration mechanisms on 3D NoC latency

  • Author

    Cataldo, Rodrigo ; Fernandes, Ramon ; Grando, Fernando ; Webber, Thais ; Benso, Ana ; Marcon, Cesar

  • Author_Institution
    PUCRS - Pontificia Univ. Catolica do Rio Grande do Sul, Porto Alegre, Brazil
  • fYear
    2014
  • Firstpage
    890
  • Lastpage
    894
  • Abstract
    This paper discusses the impact of routing arbitration mechanism on the packet latency for 3D NoC (Three-dimensional Network-on-Chip) architectures. We implemented several variations of Round-Robin mechanisms to explore how the arbitration efficiency affects the packet latency. The underlying objective is to discuss the compromise of increase router area and energy consumption through investing on a complex low-clock cycle router compared with a simpler but energy and area efficient router. The experimental setup is composed of two sizes of 3D mesh NoC, synthetic traffic pattern and several injection rates. Results demonstrate that the increase of arbitration latency does not affect proportionally the packet latency. In fact, for low traffic injection rates the arbitration algorithm does not influence the average of packet latency significantly, justifying the approach of employing less complex routers with less impact on area and energy consumption.
  • Keywords
    energy conservation; energy consumption; low-power electronics; network routing; network-on-chip; synchronisation; three-dimensional displays; 3D NoC latency; 3D mesh NoC; 3D network-on-chip architectures; arbitration latency; area efficient router; energy consumption; energy efficient router; low-clock cycle router; packet latency; round-robin mechanisms; router area; routing arbitration mechanisms; synthetic traffic pattern; traffic injection rates; Algorithm design and analysis; Clocks; Minimization; Ports (Computers); Routing; Switches; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Circuits and Systems (ICECS), 2014 21st IEEE International Conference on
  • Type

    conf

  • DOI
    10.1109/ICECS.2014.7050129
  • Filename
    7050129