Title :
Increasing Defect Coverage by Generating Test Vectors for Stuck-Open Faults
Author :
Higami, Yoshinobu ; Saluja, Kewal K. ; Takahashi, Hiroshi ; Kobayashi, Shin-ya ; Takamatsu, Yuzo
Author_Institution :
Grad. Sch. of Sci. & Eng., Ehime Univ., Matsuyama
Abstract :
Defects in the modern LSIs manufactured by the deep-submicron technologies are known to cause complex faulty phenomena. Testing by targeting only stuck-at or bridging faults is no longer sufficient. Yet, increasing defect coverage is even more important. A stuck-open fault model considers transistor level defects, many of which are not covered by a stuck-at fault model. Further, test vectors for stuck-open faults also have the ability to detect the defects modeled by delay faults. This paper presents test generation methods for stuck-open faults using stuck-at test vectors and stuck-at test generation tools. The resultant test vectors achieve high coverage of stuck open faults while maintaining the original stuck-at fault coverage, thus offering the benefit of potential better defect coverage. We consider two types of test application mechanisms, namely launch on capture test and enhanced scan test. The effectiveness of the proposed methods is established by experimental results for benchmark circuits.
Keywords :
benchmark testing; fault diagnosis; integrated circuit testing; large scale integration; logic testing; transistor circuits; LSI defect coverage; benchmark circuits; bridging faults; complex faulty phenomena; deep-submicron technology; enhanced scan test; launch on capture test; stuck-at fault model; stuck-at test generation tools; stuck-open faults; test generation methods; transistor-level defects; Benchmark testing; Circuit faults; Circuit testing; Compaction; Computer aided manufacturing; Delay; Electrical fault detection; Fault detection; Fault diagnosis; Virtual manufacturing; %Stuck-at faults; Defect coverage; Stuck-open faults; Test generation;
Conference_Titel :
Asian Test Symposium, 2008. ATS '08. 17th
Print_ISBN :
978-0-7695-3396-4
DOI :
10.1109/ATS.2008.39