• DocumentCode
    3569692
  • Title

    Considerations for efficient contact resistivity reduction via Fermi Level depinning - impact of MIS contacts on 10nm node nMOSFET DC characteristics

  • Author

    Borrel, J. ; Hutin, L. ; Rozeau, O. ; Batude, P. ; Poiroux, T. ; Nemouchi, F. ; Vinet, M.

  • Author_Institution
    STMicroelectron., Crolles, France
  • fYear
    2015
  • Abstract
    In the overwhelming majority of cases, current-voltage characteristics of metal-based contacts on semiconductors are non-linear around 0V even for degenerate interfacial doping levels. Any contact resistivity specification is therefore meaningless without the knowledge of the effective bias across the contact. For the first time, the efficiency of a dielectric insertion for contact resistance reduction was properly evaluated by solving the self-consistent case of voltage sharing for an aggressively scaled transistor flanked by two trench Metal/ Insulator/Semiconductor (MIS) contacts. We found that leveraging the Fermi Level depinning via optimized MIS contacts could lead to a +92% drive current (VGS=Vdd=0.7V) increase versus a Titanium liner-based silicidation-free approach.
  • Keywords
    Fermi level; MIS structures; MOSFET; electrical resistivity; Fermi level depinning; MIS contacts; current-voltage characteristics; dielectric insertion; efficient contact resistivity reduction; metal based contacts; nMOSFET DC characteristics; size 10 nm; trench metal- insulator-semiconductor contact; Dielectrics; Junctions; Metals; Ohmic contacts; SPICE; Silicon; Zirconium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSI Technology), 2015 Symposium on
  • ISSN
    0743-1562
  • Type

    conf

  • DOI
    10.1109/VLSIT.2015.7223710
  • Filename
    7223710