DocumentCode
3569692
Title
Considerations for efficient contact resistivity reduction via Fermi Level depinning - impact of MIS contacts on 10nm node nMOSFET DC characteristics
Author
Borrel, J. ; Hutin, L. ; Rozeau, O. ; Batude, P. ; Poiroux, T. ; Nemouchi, F. ; Vinet, M.
Author_Institution
STMicroelectron., Crolles, France
fYear
2015
Abstract
In the overwhelming majority of cases, current-voltage characteristics of metal-based contacts on semiconductors are non-linear around 0V even for degenerate interfacial doping levels. Any contact resistivity specification is therefore meaningless without the knowledge of the effective bias across the contact. For the first time, the efficiency of a dielectric insertion for contact resistance reduction was properly evaluated by solving the self-consistent case of voltage sharing for an aggressively scaled transistor flanked by two trench Metal/ Insulator/Semiconductor (MIS) contacts. We found that leveraging the Fermi Level depinning via optimized MIS contacts could lead to a +92% drive current (VGS=Vdd=0.7V) increase versus a Titanium liner-based silicidation-free approach.
Keywords
Fermi level; MIS structures; MOSFET; electrical resistivity; Fermi level depinning; MIS contacts; current-voltage characteristics; dielectric insertion; efficient contact resistivity reduction; metal based contacts; nMOSFET DC characteristics; size 10 nm; trench metal- insulator-semiconductor contact; Dielectrics; Junctions; Metals; Ohmic contacts; SPICE; Silicon; Zirconium;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSI Technology), 2015 Symposium on
ISSN
0743-1562
Type
conf
DOI
10.1109/VLSIT.2015.7223710
Filename
7223710
Link To Document