Title :
3D-IC FPGA: KGD, DFT and build-in FA capabilities
Author_Institution :
Xilinx Inc., San Jose, CA, USA
Abstract :
Among many challenges in the development of 3D-IC products, cost is one of the top concerns. Within cost elements, known-good-die (KGD) and 3D-IC integration yield, are among a few biggest impacting factors. In order to achieve high 3D-IC integration yield, build-in self-repairing, design-for-testing (DFT), diagnostic, and failure analysis (FA) capabilities, are very important elements of 3D-IC FPGA technology and product development and manufacturing.
Keywords :
built-in self test; design for testability; failure analysis; field programmable gate arrays; integrated circuit manufacture; integrated circuit reliability; three-dimensional integrated circuits; 3D-IC FPGA; build-in self-repairing; design-for-testing; failure analysis; known-good-die; product development; product manufacturing; Discrete Fourier transforms; Field programmable gate arrays; Integrated circuit interconnections; Silicon; Stacking; Testing; Three-dimensional displays;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
DOI :
10.1109/IPFA.2015.7224317
