DocumentCode

3572396

Title

The Future for Multichip Modules

Author

Sage, M.G.

Author_Institution

BPA Ltd, Surrey, United Kingdom

fYear

1992

Firstpage

517

Lastpage

517

Keywords

Assembly systems; Design engineering; Microelectronics; Multichip modules; System testing; Technological innovation;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Device Research Conference, 1992. ESSDERC '92. 22nd European

Print_ISBN

444894780

Type

conf

Filename

5435151