Title :
A new plank in the platform: object-oriented extensions to platform R&D
Author :
Usrey, Michael W. ; Garrett, William
Author_Institution :
Coll. of Eng. & Appl. Sci., Colorado Univ., CO, USA
Abstract :
Platform R&D has been shown to be a useful technique to diversify product offerings, reduce product costs, improve time to market, and improve product quality. Techniques for the architectural design of product platforms have evolved from industry-specific models to more generic approaches. Modularity is a key aspect of product platform architecture. Object-oriented design is a proven technique for developing software that is extendable, reusable, and easy to maintain, all of which positively impact quality and lifecycle costs. Object-oriented programming languages abound. Modularity is a significant facet of object-oriented design. Given the shared focus on modularity, it is not surprising that a comparison of object-oriented design and platform R&D methodologies yields several similarities. However, a contrast of these techniques suggests some principles from the field of object-oriented design that might be beneficially applied to the platform R&D process. In particular, object-oriented methodology is more explicit in characterizing module interface design. A synthesis of these two approaches is proposed
Keywords :
object-oriented methods; product development; research and development management; industry-specific models; lifecycle costs; object-oriented design; object-oriented extensions; object-oriented programming languages; platform R&D; platform R&D process; product costs reduction; product offerings diversification; product platform architecture; product quality improvement; quality; time to market improvement; Biomedical engineering; Computer architecture; Costs; Educational institutions; Object oriented modeling; Paper technology; Product design; Research and development; Research and development management; Time to market;
Conference_Titel :
Engineering Management Society, 2000. Proceedings of the 2000 IEEE
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7803-6442-2
DOI :
10.1109/EMS.2000.872552