Title :
Solder Bump Fabrication On Wafers By Electroplating Process
Author :
Watanabe, S. ; Ihara, Y. ; Kitahara, Y. ; Kobayashi, F. ; Wakabayashi, S.
Keywords :
Chromium; Copper; Fabrication; Flip chip; Gold; Oxidation; Resists; Shape; Sputtering; Thermal stresses;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Print_ISBN :
0-7803-4235-6
