Solder Bump Fabrication On Wafers By Electroplating Process

Author

Watanabe, S. ; Ihara, Y. ; Kitahara, Y. ; Kobayashi, F. ; Wakabayashi, S.

fYear

1997

Firstpage

110

Lastpage

115

Keywords

Chromium; Copper; Fabrication; Flip chip; Gold; Oxidation; Resists; Shape; Sputtering; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Print_ISBN

0-7803-4235-6

Type

Filename

618988

Link To Document