Title :
TDR analysis in the design of X-band LTCC tile T/R modules
Author :
Zhang Zhi-Guang ; Xu Zheng
Author_Institution :
Dept. of Space Microwave Remote Sensing Syst., Inst. of Electron., Beijing, China
Abstract :
Time Domain Reflectometry (TDR) has been introduced into the design of X-band tile Transmit/Receive (T/R) modules fabricated with Low Temperature Co-fired Ceramics (LTCC) processing. TDR simulation exhibits additional capability compared with S-parameter simulation, especially in the aspect of vertical interconnection scheme. Vertical quasi-coax interconnection and wire bonding schemes have been explored using TDR. Benefits brought from TDR made it an indispensable tool in designing compact tile T/R modules.
Keywords :
S-parameters; ceramic packaging; coaxial cables; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; lead bonding; radio receivers; radio transmitters; time-domain reflectometry; LTCC processing; S-parameter simulation; T-R modules; TDR analysis; TDR simulation; X-band LTCC tile; low temperature co-fired ceramics processing; time domain reflectometry; transmit-receive modules; vertical interconnection scheme; vertical quasicoax interconnection; wire bonding schemes; Bonding; Impedance; Microstrip; Radio frequency; Scattering parameters; Simulation; Wires; LTCC; TDR; quasi-coax; tile T/R modules; vertical interconnection;
Conference_Titel :
Intelligent Control and Automation (WCICA), 2014 11th World Congress on
DOI :
10.1109/WCICA.2014.7053652
