• DocumentCode
    3573708
  • Title

    Interconnect Geometric Parameters Optimization

  • Author

    Delorme, Nicolas ; Belleville, Mare

  • Author_Institution
    LETI-CEA-GRENOBLE, 17 avenue des Martyrs, 38054 Grenoble CEDEX 9, France
  • fYear
    1996
  • Firstpage
    671
  • Lastpage
    674
  • Abstract
    The existence of an optimum line aspect ratio that minimizes interconnect delay for a given configuration is demonstrated. We study the sensitivity of this ratio to several line configurations and technological variations. The variation of far-end crosstalk voltage is also investigated with respect to line aspect ratio.
  • Keywords
    Capacitance; Crosstalk; Delay effects; Design optimization; Dielectrics; Electromagnetic analysis; Geometry; Guidelines; Solid modeling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
  • Print_ISBN
    286332196X
  • Type

    conf

  • Filename
    5436079
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3573708