Title :
Novel Mbb Technology Using Electroless Plated Ni And In Bumps
Author :
Ohtsuka, Takashi ; Kawakita, Tetsuo ; Fujimoto, Hiroaki ; Hatada, Kenzo
Keywords :
Artificial intelligence; Bonding processes; Closed loop systems; Costs; Electrodes; Gold; Indium; Large scale integration; Microprocessors; Temperature;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Print_ISBN :
0-7803-4235-6
