DocumentCode
3573727
Title
Novel Mbb Technology Using Electroless Plated Ni And In Bumps
Author
Ohtsuka, Takashi ; Kawakita, Tetsuo ; Fujimoto, Hiroaki ; Hatada, Kenzo
fYear
1997
Firstpage
169
Lastpage
173
Keywords
Artificial intelligence; Bonding processes; Closed loop systems; Costs; Electrodes; Gold; Indium; Large scale integration; Microprocessors; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618999
Link To Document