• DocumentCode
    3573835
  • Title

    Analysis of Leakage Currents in Smart Power Devices

  • Author

    Knaipp, M. ; Simlinger, T. ; Kanert, W. ; Selberherr, Siegfried

  • Author_Institution
    Institute for Microelectronics, TU Vienna, Gusshausstrasse 27-29, A-1040 Vienna, Austria
  • fYear
    1996
  • Firstpage
    645
  • Lastpage
    648
  • Abstract
    The Smart Power Device under consideration is a buried layer device which is widely used in industry. An n-doped epitaxy layer is grown on a highly n-doped buried layer. This layer is placed on the p-substrate. The epitaxy-and buried layers are surrounded by a double diffused p-isolation. The leakage currents between the epitaxy layer and the isolation are simulated and measured in a temperature range from 300 K to 500 K.
  • Keywords
    Automotive engineering; Current measurement; Doping profiles; Epitaxial growth; Isolation technology; Leakage current; Manufacturing industries; Semiconductor process modeling; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
  • Print_ISBN
    286332196X
  • Type

    conf

  • Filename
    5436103