• DocumentCode
    3574585
  • Title

    Modeling and behaviour of partial discharge in nanocomposite materials

  • Author

    Balagurusamy, P. ; Maheswari, R.V. ; Vigneshwaran, B. ; Iruthayarajan, M. Willjuice

  • Author_Institution
    Dept. of EEE, Nat. Eng. Coll., Kovilpatti, India
  • fYear
    2014
  • Firstpage
    350
  • Lastpage
    356
  • Abstract
    Partial Discharge (PD) behaviour in electrical apparatus leads to identify the degradation of insulating materials. This paper provides an analysis of Electric Field (E-Field), Electric potential distributions and Temperature analysis of the nanocomposite materials. The ultimate aim of this simulation studies are carried out to improve the breakdown strength of the nanocomposite materials for long term performances. The major factors that governs the performances of the insulating materials is E-Field and Electric potential distribution which leads to PD and temperature rise which reduces the breakdown strength of the materials. The analysis are performed by modeling the nanocomposite materials in two dimensions (2D) using Finite Element Method (FEM) with nanoparticles of different size for different combinations. According to the results, Polycarbonate (base material) with nanoparticle (SiO2) of 5% size when compared to base materials shows better performances and nominal temperature rise.
  • Keywords
    electric field effects; finite element analysis; nanocomposites; nanoparticles; partial discharges; silicon compounds; FEM; SiO2; breakdown strength; electric field analysis; electric potential distributions; finite element method; insulating materials; nanocomposite materials; nanoparticles; partial discharge; polycarbonate; temperature analysis; Electric breakdown; Electric fields; Electric potential; Finite element analysis; Nanoparticles; Nanostructured materials; Electric Field distribution; Finite Element Method; Nanocomposite material; Partial Discharge; Temperature rise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuit, Power and Computing Technologies (ICCPCT), 2014 International Conference on
  • Print_ISBN
    978-1-4799-2395-3
  • Type

    conf

  • DOI
    10.1109/ICCPCT.2014.7055056
  • Filename
    7055056