DocumentCode :
3574762
Title :
Design considerations for wide bandgap based motor drive systems
Author :
Scott, Mark J. ; Lixing Fu ; Chengcheng Yao ; Xuan Zhang ; Longya Xu ; Jin Wang ; Zamora, Rachid Darbali
Author_Institution :
Dept. of Electr. & Comput. Eng., Ohio State Univ., Columbus, OH, USA
fYear :
2014
Firstpage :
1
Lastpage :
6
Abstract :
The backbone of traction drive systems for electrified vehicles is based on the insulated gate bipolar junction transistors (IGBT) created from silicon (Si). Over the last several years, switching devices made from silicon carbide (SiC) and gallium nitride (GaN) have become available. This has resulted in the construction of power electronic systems with greater power densities and better efficiency over similarly rated Si based versions. Yet some hurdles still remain prior to wide spread adoption of these components in automotive power electronics. The following paper reviews the current state-of-art for SiC and GaN based power devices. Challenges in their implementation and barriers to commercialization are presented. This information is supplemented with test results from a thermal investigation. The impact of high speed wide bandgap power devices on the reflected wave phenomenon is also explored.
Keywords :
III-V semiconductors; gallium compounds; hybrid electric vehicles; insulated gate bipolar transistors; power bipolar transistors; silicon compounds; traction motor drives; wide band gap semiconductors; GaN; IGBT; SiC; electrified vehicles; insulated gate bipolar junction transistors; power density; power electronic systems; reflected wave phenomenon; traction drive systems; wide bandgap based motor drive systems; wide bandgap power device; Cable shielding; Gallium nitride; Logic gates; Power electronics; Silicon; Silicon carbide; Switches; gallium nitride; high electron mobility transistor; motor drives; reflected wave phenomenon; silicon carbide; wide bandgap semiconductors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electric Vehicle Conference (IEVC), 2014 IEEE International
Type :
conf
DOI :
10.1109/IEVC.2014.7056214
Filename :
7056214
Link To Document :
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