Reliability characterization of a soot particle sensor: Analysis of stress- and electromigration in thin-film platinum

Author

Rusanov, Radoslav ; Graf, Juergen ; Rank, Holger ; Fuchs, Tino ; Mueller-Fiedler, Roland ; Kraft, Oliver

Author_Institution

Microsyst. Technol., Robert Bosch GmbH, Gerlingen-Schillerhoehe, Germany

fYear

2014

Firstpage

1

Lastpage

6

Abstract

In this work we present a systematic investigation of failure mechanisms for thin-film platinum heater structures and interdigitated electrodes as components of a resistive type soot particle sensor. We study stress-migration and electromigration and effects of their interaction. Lifetime determination and SEM imaging are applied for samples which have experienced different load conditions to quantitatively and qualitatively understand the phenomena. We use dedicated, application-related test structures to ensure that the results are transferable to sensor lifetime estimations.

Keywords

electrochemical electrodes; electromigration; failure analysis; particle detectors; platinum; reliability; scanning electron microscopy; soot; stress analysis; thin film sensors; Pt; SEM imaging; application-related test structure; electromigration; failure mechanism; interdigitated electrode; reliability characterization; resistive type soot particle sensor; stress-migration analysis; thin-film platinum heater structure; Current density; Electromigration; Feeds; Heating; Materials; Plasma temperature; Platinum; MEMS; electromigration; harsh environment; platinum; reliability; soot particle sensor; stress-migration;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on

Print_ISBN

978-2-35500-028-7

Type

conf

DOI

10.1109/DTIP.2014.7056639

Filename

7056639