Parametric study on thermal performance of a hybrid double-side micro-jet cooling system

Parametric study on thermal performances of a hybrid double-side micro-jet cooling system were performed through the three-dimensional Reynolds-averaged Navier-Stokes analysis. Three design variables, viz, the diameter of the jet hole, the distance from the upper jet exit to substrate, and the distance from the lower jet exit to substrate were assessed to analyze the impact on cooling performance. The steady incompressible turbulent flow and conjugate heat transfer in the cooling system were calculated using the shear stress transport turbulence model. The grid dependency test was performed to determine the optimal number of grids to reduce the computational time and conserve system resources. To validate current study, the numerical results were compared with experimental data, and it shows good agreements. To compare the cooling performance, the maximum temperature on the semiconductor and the pressure drop were assessed. As a result, the diameter of jet shows the highest sensitivity on the maximum temperature. The distance from the lower jet exit to substrate also shows the largest impact on the pressure drop, while the other design variables show little differences.