DocumentCode
3574980
Title
Design and analysis of polysilicon thin layers and MEMS vibrating structures
Author
Voicu, Rodica ; Gavrila, Raluca ; Obreja, Cosmin ; Muller, Raluca ; Baracu, Angela ; Michalowski, Marcin ; Rymuza, Zygmunt
Author_Institution
Nat. Inst. for R&D in Microtechnologies, IMT Bucharest, Bucharest, Romania
fYear
2014
Firstpage
1
Lastpage
5
Abstract
Natural frequencies of an array of microcantilevers designed with different dimensions were analysed using computer simulations. Four different types of polysilicon were obtained in different processing conditions varying the deposition temperatures (580°C, 610°C, 630°C, 650°C). A topography scan, a comparative friction test and adhesive tests (pull off-force measurement) were carried out using Atomic Force Microscope (AFM) in order to characterize the material properties. Mechanical properties such as hardness and Young´s modulus have been investigated using the nanoindenter technique. The microcantilevers have been manufactured using polysilicon as structural material and surface micromachining technique.
Keywords
atomic force microscopy; cantilevers; elemental semiconductors; micromachining; micromechanical devices; nanoindentation; silicon; AFM; MEMS vibrating structures; Young modulus; adhesive test; atomic force microscope; comparative friction test; computer simulation; deposition temperature; hardness; material property characterisation; mechanical properties; microcantilever array; microcantilevers; nanoindenter technique; natural frequency; polysilicon thin layers; pull off-force measurement; structural material; surface micromachining technique; temperature 580 degC; temperature 610 degC; temperature 630 degC; temperature 650 degC; topography scan; Atomic measurements; Force; Force measurement; Friction; Micromechanical devices; Surface topography; Temperature measurement; MEMS; cantilever; polysilicon; surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN
978-2-35500-028-7
Type
conf
DOI
10.1109/DTIP.2014.7056664
Filename
7056664
Link To Document