• DocumentCode
    3574980
  • Title

    Design and analysis of polysilicon thin layers and MEMS vibrating structures

  • Author

    Voicu, Rodica ; Gavrila, Raluca ; Obreja, Cosmin ; Muller, Raluca ; Baracu, Angela ; Michalowski, Marcin ; Rymuza, Zygmunt

  • Author_Institution
    Nat. Inst. for R&D in Microtechnologies, IMT Bucharest, Bucharest, Romania
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Natural frequencies of an array of microcantilevers designed with different dimensions were analysed using computer simulations. Four different types of polysilicon were obtained in different processing conditions varying the deposition temperatures (580°C, 610°C, 630°C, 650°C). A topography scan, a comparative friction test and adhesive tests (pull off-force measurement) were carried out using Atomic Force Microscope (AFM) in order to characterize the material properties. Mechanical properties such as hardness and Young´s modulus have been investigated using the nanoindenter technique. The microcantilevers have been manufactured using polysilicon as structural material and surface micromachining technique.
  • Keywords
    atomic force microscopy; cantilevers; elemental semiconductors; micromachining; micromechanical devices; nanoindentation; silicon; AFM; MEMS vibrating structures; Young modulus; adhesive test; atomic force microscope; comparative friction test; computer simulation; deposition temperature; hardness; material property characterisation; mechanical properties; microcantilever array; microcantilevers; nanoindenter technique; natural frequency; polysilicon thin layers; pull off-force measurement; structural material; surface micromachining technique; temperature 580 degC; temperature 610 degC; temperature 630 degC; temperature 650 degC; topography scan; Atomic measurements; Force; Force measurement; Friction; Micromechanical devices; Surface topography; Temperature measurement; MEMS; cantilever; polysilicon; surface topography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
  • Print_ISBN
    978-2-35500-028-7
  • Type

    conf

  • DOI
    10.1109/DTIP.2014.7056664
  • Filename
    7056664