DocumentCode :
3574996
Title :
Creep in MEMS
Author :
Soma, A. ; De Pasquale, G. ; Saleem, M.M.
Author_Institution :
Dept. of Mech. & Aerosp. Eng., Politec. di Torino, Turin, Italy
fYear :
2014
Firstpage :
1
Lastpage :
4
Abstract :
The study of creep in MEMS is crucial for their lifetime prediction and reliability evaluation. The experimental approaches used in macromechanics can be extended to the microscale if their effectiveness is proved by dedicated experiments. This goal may provide more general validity of creep effects prediction in MEMS, instead of spotted experiments on single devices like those ones reported in most of the work presented in literature. The demonstration of the validity of some established creep models and experimental methodologies also in the micromechanics is the goal of this paper.
Keywords :
creep; micromechanical devices; semiconductor device reliability; MEMS; creep effects prediction; lifetime prediction; macromechanics; micromechanics; reliability evaluation; Creep; Fatigue; Micromechanical devices; Reliability; Strain; Stress; Temperature measurement; creep; lifetime; permanent strain; plastic strain; reliability; temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN :
978-2-35500-028-7
Type :
conf
DOI :
10.1109/DTIP.2014.7056680
Filename :
7056680
Link To Document :
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