• DocumentCode
    3575000
  • Title

    Simulation and characterization of dynamic contact in a MEMS passive vibration threshold sensor

  • Author

    Zhuoqing Yang ; Wenguo Chen ; Guifu Ding ; Yan Wang ; Hong Wang ; Xiaolin Zhao

  • Author_Institution
    Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A micro-machined passive vibration threshold sensor (i.e. acceleration switch) with a compliant stationary electrode has been designed, simulated and characterized. Bridge-type elastic beams as the compliant stationary electrode are adopted to improve the contact effect of the sensor. The dynamic contact between the two electrodes is simulated and analyzed by finite-element method (FEM). It is presented that a `skip contact´ phenomenon occurred during the switching on, which has been described and successfully explained in this paper. A drop hammer test of the fabricated vibration threshold sensor was done, which is in accordance with the simulated one. The measured two contact times in the skip contact are 16μs and 4μs under 55g applied acceleration shock, respectively, which are in agreement with simulated results.
  • Keywords
    elasticity; finite element analysis; microelectrodes; micromachining; microsensors; vibration measurement; Bridge-type elastic beam; FEM; MEMS passive vibration threshold sensor; acceleration shock; acceleration switch; compliant stationary electrode; drop hammer testing; finite-element method; micromachined passive vibration threshold sensor; skip contact phenomenon; time 16 mus; time 4 mus; Acceleration; Contacts; Electrodes; Finite element analysis; Micromechanical devices; Switches; Vibrations; MEMS; dropping hammer test; dynamic contact; micromachining; vibration threshold sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
  • Print_ISBN
    978-2-35500-028-7
  • Type

    conf

  • DOI
    10.1109/DTIP.2014.7056684
  • Filename
    7056684