Title :
Non-invasive capacitive pressure sensor: Microfabrication process and first electro-mechanical characterization
Author :
Dinh, T.H.N. ; Joubert, P.-Y. ; Martincic, E. ; Dufour-Gergam, E.
Author_Institution :
Univ. Paris Sud, Orsay, France
Abstract :
Kapton-based flexible pressure sensor arrays are fabricated using a new technology of film transfer. The sensors are dedicated to the non-invasive measurement of pressure/force in robotic, sport and medical applications. The sensors are of a capacitive type, and composed of two millimetric copper electrodes, separated by a polydimethylsiloxane (PDMS) deformable dielectric layer. On the flexible arrays, a very small curvature radius is possible without any damage to the sensors. The inhomogeneity of the capacitances in array is quite low (deviation of ±7% compared to the average value). The process is accurate and reproducible (transfer yield of 100%). The electrical characterization is also presented. In the preliminary electro-mechanical characterization, a sensor (with a PDMS dielectric layer of 660 μm thickness and a free load capacitance of 480 fF) undergoes a capacitance change of 17% under a 300 kPa normal stress.
Keywords :
capacitance measurement; capacitive sensors; force measurement; force sensors; microfabrication; microsensors; pressure measurement; pressure sensors; sensor arrays; thin film sensors; Kapton-based flexible pressure sensor array; PDMS; capacitance 480 fF; deformable dielectric layer; electromechanical characterization; medical application; microfabrication process; millimetric copper electrode; noninvasive capacitive pressure sensor; noninvasive pressure-force measurement; polydimethylsiloxane deformable dielectric layer; robotic application; size 660 mum; sport application; Capacitance; Copper; Fabrication; Films; Robot sensing systems; Sensor arrays; Substrates; PDMS; capacitive pressure sensor; characterization; fabrication process; film transfer;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN :
978-2-35500-028-7
DOI :
10.1109/DTIP.2014.7056694