DocumentCode :
3575015
Title :
Determination of material properties and failure using in-situ thermo-mechanical probe
Author :
Arrazat, B. ; Orellana, S. ; Rivero, C. ; Fornara, P. ; Di-Giacomo, A. ; Blayac, S. ; Montmitonnet, P. ; Inal, K.
Author_Institution :
CMP, Ecole Nat. Super. des Mines de St.-Etienne, Gardanne, France
fYear :
2014
Firstpage :
1
Lastpage :
5
Abstract :
A metallic in-situ stress sensor is modified to address electrical polarization and thus to locally heat this sensor by Joule effect. By coupling SEM electrical nano-probing with analytical modeling and multiphysics Finite Element Method (FEM), the thermo-mechanical properties are identified. As a result, a tensile stress state of 190 MPa, coefficient of thermal expansion of 22.5×10-6 K-1 and thermal conductivity of 190 W/(K·m) are identified in the aluminum thin film in agreement with literature. Moreover, high current induces irreversible deformation and breaking. Using multiphysics FE model with identified thermo-mechanical properties, the failure of the sensor under electrical solicitation is investigated. The evolution of local temperature and mechanical deformation on different sensor designs allows the determination of the breaking location and condition.
Keywords :
aluminium; deformation; finite element analysis; metallic thin films; scanning electron microscopy; stress measurement; tensile strength; thermal conductivity; thermal expansion; Al; Joule effect; SEM; aluminum thin film; electrical nanoprobing; electrical polarization; electrical solicitation; failure; finite element method; in-situ thermo-mechanical probe; irreversible deformation; local temperature; material properties; mechanical deformation; metallic in-situ stress sensor; tensile stress state; thermal conductivity; thermal expansion coefficient; thermo-mechanical properties; Conductivity; Finite element analysis; Stress; Temperature measurement; Temperature sensors; Thermal conductivity; Thermal expansion; Back-End of Line (BEoL); Finite Element Modeling; Joule effect; embedded sensor; failure mechanisms; in-situ SEM nano-probing; thermo-mechanical properties;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN :
978-2-35500-028-7
Type :
conf
DOI :
10.1109/DTIP.2014.7056700
Filename :
7056700
Link To Document :
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