• DocumentCode
    3575016
  • Title

    Determination of the severity of thermal stress using model data calculated from thermal transient results

  • Author

    Sarkany, Zoltan ; Rencz, Marta

  • Author_Institution
    Mentor Graphics Corp., Budapest, Hungary
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this article a method is presented for the calculation of structural and thermal parameters from thermal transient measurement results in order to be used as input data for thermal stress simulation. It is shown how the geometry of the internal structure of the package and the temperature distribution can be approximated from the thermal response function measured after switching on a heating element in the package.
  • Keywords
    heating elements; semiconductor device models; semiconductor device packaging; temperature distribution; temperature measurement; thermal stresses; heating element; model data; temperature distribution; thermal response function; thermal stress simulation; thermal transient measurement results; Heating; Semiconductor device measurement; Stress; Temperature distribution; Temperature measurement; Thermal stresses; Transient analysis; Thermal transient measurement; structure function; temperature distribution; thermal stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
  • Print_ISBN
    978-2-35500-028-7
  • Type

    conf

  • DOI
    10.1109/DTIP.2014.7056701
  • Filename
    7056701