Title :
Determination of the severity of thermal stress using model data calculated from thermal transient results
Author :
Sarkany, Zoltan ; Rencz, Marta
Author_Institution :
Mentor Graphics Corp., Budapest, Hungary
Abstract :
In this article a method is presented for the calculation of structural and thermal parameters from thermal transient measurement results in order to be used as input data for thermal stress simulation. It is shown how the geometry of the internal structure of the package and the temperature distribution can be approximated from the thermal response function measured after switching on a heating element in the package.
Keywords :
heating elements; semiconductor device models; semiconductor device packaging; temperature distribution; temperature measurement; thermal stresses; heating element; model data; temperature distribution; thermal response function; thermal stress simulation; thermal transient measurement results; Heating; Semiconductor device measurement; Stress; Temperature distribution; Temperature measurement; Thermal stresses; Transient analysis; Thermal transient measurement; structure function; temperature distribution; thermal stress;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2014 Symposium on
Print_ISBN :
978-2-35500-028-7
DOI :
10.1109/DTIP.2014.7056701
