DocumentCode
357740
Title
Design issues in the packaging of heterogeneous systems
Author
Swaminathan, M. ; Tentzeris, M.
Author_Institution
Sch. of Electr. and Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
2
fYear
2000
fDate
16-21 July 2000
Firstpage
592
Abstract
This paper discusses some of the design issues associated with the packaging of future wireless systems. These systems include consumer products such as cellular phones and telecommunication products such as portable, multimedia applications.
Keywords
consumer electronics; integrated circuit packaging; micromechanical devices; multimedia communication; radio equipment; telecommunication equipment; MEMS; SLIM; cellular phones; consumer products; design issues; heterogeneous systems packaging; multimedia applications; portable applications; single level integrated module; telecommunication products; wireless systems; Analytical models; Cellular phones; Circuit simulation; Cost function; Dielectric substrates; Electromagnetic scattering; Integrated circuit interconnections; Isolation technology; Packaging; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2000. IEEE
Conference_Location
Salt Lake City, UT, USA
Print_ISBN
0-7803-6369-8
Type
conf
DOI
10.1109/APS.2000.875235
Filename
875235
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