Title :
Design issues in the packaging of heterogeneous systems
Author :
Swaminathan, M. ; Tentzeris, M.
Author_Institution :
Sch. of Electr. and Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper discusses some of the design issues associated with the packaging of future wireless systems. These systems include consumer products such as cellular phones and telecommunication products such as portable, multimedia applications.
Keywords :
consumer electronics; integrated circuit packaging; micromechanical devices; multimedia communication; radio equipment; telecommunication equipment; MEMS; SLIM; cellular phones; consumer products; design issues; heterogeneous systems packaging; multimedia applications; portable applications; single level integrated module; telecommunication products; wireless systems; Analytical models; Cellular phones; Circuit simulation; Cost function; Dielectric substrates; Electromagnetic scattering; Integrated circuit interconnections; Isolation technology; Packaging; Radio frequency;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2000. IEEE
Conference_Location :
Salt Lake City, UT, USA
Print_ISBN :
0-7803-6369-8
DOI :
10.1109/APS.2000.875235
