• DocumentCode
    3578114
  • Title

    Device for measuring the flexural fracture strength of etched surface

  • Author

    Jun He ; Xian Huang ; Li Zhang ; Danqi Zhao ; Fang Yang ; Dacheng Zhang

  • Author_Institution
    Inst. of Microelectron., Peking Univ., Beijing, China
  • fYear
    2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    To evaluate the quality of deep-reactive-ion-etching process quantitatively, a novel device was designed and fabricated to obtain the flexural fracture strength of etched surface. The device is composed of beam of uniform strength and on-chip multifunctional micro needle. The testing method only requires probe station in the measurement. Devices designers can utilize the method to research the mechanical reliability of the devices easily, and as for foundry, the testing result can be used as a parameter to reflect the etching capacity. From our bending test, it can be demonstrated that the fracture strength of the etched surface in our etching conditions is about 2.1 GPa.
  • Keywords
    bending strength; etching; fracture toughness; mechanical variables measurement; needles; reliability; sputter etching; bending testing; deep-reactive-ion-etching process; etched surface measurement; flexural fracture strength measurement; mechanical reliability; on-chip multifunctional microneedle; uniform strength beam; Etching; Needles; Rough surfaces; Surface cracks; Surface roughness; System-on-chip; beam of uniform strength; fracture strength; microneedle; on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits (EDSSC), 2014 IEEE International Conference on
  • Type

    conf

  • DOI
    10.1109/EDSSC.2014.7061190
  • Filename
    7061190