Title :
Device for measuring the flexural fracture strength of etched surface
Author :
Jun He ; Xian Huang ; Li Zhang ; Danqi Zhao ; Fang Yang ; Dacheng Zhang
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
Abstract :
To evaluate the quality of deep-reactive-ion-etching process quantitatively, a novel device was designed and fabricated to obtain the flexural fracture strength of etched surface. The device is composed of beam of uniform strength and on-chip multifunctional micro needle. The testing method only requires probe station in the measurement. Devices designers can utilize the method to research the mechanical reliability of the devices easily, and as for foundry, the testing result can be used as a parameter to reflect the etching capacity. From our bending test, it can be demonstrated that the fracture strength of the etched surface in our etching conditions is about 2.1 GPa.
Keywords :
bending strength; etching; fracture toughness; mechanical variables measurement; needles; reliability; sputter etching; bending testing; deep-reactive-ion-etching process; etched surface measurement; flexural fracture strength measurement; mechanical reliability; on-chip multifunctional microneedle; uniform strength beam; Etching; Needles; Rough surfaces; Surface cracks; Surface roughness; System-on-chip; beam of uniform strength; fracture strength; microneedle; on-chip;
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2014 IEEE International Conference on
DOI :
10.1109/EDSSC.2014.7061190