DocumentCode :
357837
Title :
Evaluation of multiconductor transmission line interconnects with frequency dependent loss using reduced order modeling
Author :
Smith, William T. ; Nguyen, Tuyen V.
Author_Institution :
Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
Volume :
1
fYear :
2000
fDate :
2000
Firstpage :
83
Abstract :
This paper presents a method based on multipoint Pade approximation in conjunction with the method of characteristics for the reduced order modeling and simulation of coupled multiconductor transmission lines (MTL) with frequency dependent losses. Specifically, the skin-effect loss associated with conductors is the primary modeling and simulation concern. Recursive algorithms generate sets of frequency-shifted moments used with the multipoint Pade approximation. The multipoint Pade approach provides for accurate broadband approximation of the transfer function and characteristic admittance. The time simulation is accomplished via the method of indirect numerical integration. Delay extraction is used to ensure the accuracy of the time domain simulation, especially for low loss lines
Keywords :
approximation theory; coupled transmission lines; delays; digital simulation; electric admittance; integration; interconnections; losses; multiconductor transmission lines; recursive estimation; skin effect; time-domain analysis; transfer functions; broadband approximation; characteristic admittance; coupled multiconductor transmission lines; delay extraction; frequency dependent loss; frequency-shifted moments; indirect numerical integration; low loss lines; method of characteristics; multiconductor transmission line interconnects; multipoint Pade approximation; recursive algorithms; reduced order modeling; simulation; skin-effect loss; time domain simulation; transfer function; Admittance; Computational modeling; Eigenvalues and eigenfunctions; Equations; Frequency dependence; Multiconductor transmission lines; Propagation losses; Reduced order systems; Skin effect; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5677-2
Type :
conf
DOI :
10.1109/ISEMC.2000.875542
Filename :
875542
Link To Document :
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