DocumentCode :
357840
Title :
FDTD and FEM/MOM modeling of EMI resulting from a trace near a PCB edge
Author :
Berg, D. ; Tanaka, M. ; Ji, Y. ; Ye, X. ; Drewniak, J.L. ; Hubing, T.H. ; Dussrof, R.E. ; Van Doren, T.P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA
Volume :
1
fYear :
2000
fDate :
2000
Firstpage :
135
Abstract :
PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling
Keywords :
electromagnetic interference; finite difference time-domain analysis; finite element analysis; method of moments; printed circuit design; printed circuit layout; EMI problems; FDTD modeling; FEM/MOM modeling; PCB edge; PCB layout; PCB traces; design maxims; experiment; high frequency components; high-speed signals; numerical modeling; printed circuit design; trace routing; Electromagnetic interference; Finite difference methods; Frequency; Impedance; Inductance; Magnetic fields; Message-oriented middleware; Numerical models; Signal design; Time domain analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5677-2
Type :
conf
DOI :
10.1109/ISEMC.2000.875551
Filename :
875551
Link To Document :
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