FDTD and FEM/MOM modeling of EMI resulting from a trace near a PCB edge

Author

Berg, D. ; Tanaka, M. ; Ji, Y. ; Ye, X. ; Drewniak, J.L. ; Hubing, T.H. ; Dussrof, R.E. ; Van Doren, T.P.

Author_Institution

Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA

Volume

1

fYear

2000

fDate

2000

Firstpage

135

Abstract

PCB traces routed near board edges and carrying high-speed signals are considered to contribute to EMI problems. Consequently, design maxims state that traces that might have intentional or unintentional high frequency components on them be kept away from board edges. This costs valuable surface area as boards become more densely designed. Further, design maxims concerning traces near board edges are not well quantified. The increase in EMI as a trace is routed increasingly closer to the PCB edge has been studied experimentally and with numerical modeling

Keywords

electromagnetic interference; finite difference time-domain analysis; finite element analysis; method of moments; printed circuit design; printed circuit layout; EMI problems; FDTD modeling; FEM/MOM modeling; PCB edge; PCB layout; PCB traces; design maxims; experiment; high frequency components; high-speed signals; numerical modeling; printed circuit design; trace routing; Electromagnetic interference; Finite difference methods; Frequency; Impedance; Inductance; Magnetic fields; Message-oriented middleware; Numerical models; Signal design; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2000. IEEE International Symposium on

Conference_Location

Washington, DC

Print_ISBN

0-7803-5677-2

Type

conf

DOI

10.1109/ISEMC.2000.875551

Filename

875551