DocumentCode
357871
Title
A general approach for the analysis of finite size PCB ground planes
Author
Celozzi, S. ; Panariello, G. ; Schettino, F. ; Verolino, L.
Author_Institution
Dept. of Electr. Eng., Rome Univ., Italy
Volume
1
fYear
2000
fDate
2000
Firstpage
357
Abstract
The analysis of the current distribution on ground planes of printed circuit boards is carried out by means of a very efficient dual approach and compared with numerical results. The current density inside ground planes of finite thickness is also analytically determined and the per unit length parameters evaluated
Keywords
current density; current distribution; earthing; electric impedance; electromagnetic compatibility; electromagnetic fields; integral equations; printed circuits; EMC; MoM; characteristic impedance; current density; current distribution; dual integral formulation; finite size PCB ground planes; finite thickness ground planes; numerical results; per unit length parameters; printed circuit boards; propagation constant; radiated electromagnetic field; Circuit analysis; Current density; Current distribution; Electromagnetic compatibility; Electromagnetic fields; Fourier transforms; Impedance; Microstrip; Printed circuits; Strips;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2000. IEEE International Symposium on
Conference_Location
Washington, DC
Print_ISBN
0-7803-5677-2
Type
conf
DOI
10.1109/ISEMC.2000.875593
Filename
875593
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