• DocumentCode
    357879
  • Title

    Weak boundary treatment for high-order transient analysis of MTLs

  • Author

    Grivet-Talocia, S. ; Canavero, F.

  • Author_Institution
    Dipt. di Elettronica, Politecnico di Torino, Italy
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    409
  • Abstract
    This paper presents an innovative treatment of the boundary conditions for the transient simulation of arbitrary interconnects with high-order and/or wavelet-based adaptive schemes. These can be shown to provide better accuracy and less dispersion than standard FDTD schemes. A weak treatment of the boundary conditions allows one to prove explicitly the strict (late time) stability of the discretized system, while preserving high-order accuracy also at the boundaries. This procedure can be applied to the discretization and simulation of possibly complex interconnect networks with arbitrary nonlinear and/or dynamic junctions. Results are given for explicit and implicit fourth-order accurate schemes in both space and time
  • Keywords
    boundary-value problems; digital simulation; finite difference time-domain analysis; interconnections; multiconductor transmission lines; stability; transient analysis; transmission line matrix methods; wavelet transforms; FDTD; MTL; boundary conditions; discretized system; dynamic junctions; fourth-order accurate schemes; high-order accuracy; high-order adaptive schemes; high-order transient analysis; interconnect networks; interconnects; late time stability; matrix; multiconductor transmission lines; nonlinear junctions; simulation; strict stability; transient simulation; wavelet-based adaptive schemes; weak boundary treatment; Boundary conditions; Finite difference methods; Integrated circuit interconnections; Multiconductor transmission lines; Nonlinear equations; Power transmission lines; Testing; Time domain analysis; Transient analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2000. IEEE International Symposium on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-5677-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2000.875603
  • Filename
    875603