• DocumentCode
    357950
  • Title

    Electroluminescence in silicon oxynitride

  • Author

    Kato, Haruhisa ; Sato, Hikaru ; Ohki, Y. ; Fujimaki, Makoto

  • Author_Institution
    RIKEN, Inst. of Phys. & Chem. Res., Saitama
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    402
  • Abstract
    The mechanism of electroluminescence (EL) in silicon oxynitride (SiOxNy) was investigated. The samples tested were SiOxNy films grown by plasma enhanced chemical vapor deposition. The EL can be observed only in the sample with a high nitrogen content and thermally annealed at a high temperature. The EL peak energy decreases from 2.1 eV to 1.7 eV as the nitrogen content increases. It is already known from photoluminescence study that the present samples have at least partially a mixture structure of Si3 N4 and SiO2 which are respectively responsible for the two photoluminescence bands at 2.6-2.9 and 2.7 eV in the samples. The conduction in the electric field region where the EL is observable is considered to be governed by the Poole-Frenkel process. From these results, it is concluded that the EL is caused by radiative recombination of electrons and holes in the Si3N4 region
  • Keywords
    Poole-Frenkel effect; annealing; dielectric thin films; electroluminescence; electron-hole recombination; plasma CVD coatings; silicon compounds; Poole-Frenkel conduction; SiON; electric field; electroluminescence; mixture structure; nitrogen content; plasma enhanced chemical vapor deposition; radiative recombination; silicon oxynitride film; thermal annealing; Annealing; Chemical vapor deposition; Electroluminescence; Nitrogen; Photoluminescence; Plasma chemistry; Plasma temperature; Radiative recombination; Silicon; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2000. Proceedings of the 6th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    0-7803-5459-1
  • Type

    conf

  • DOI
    10.1109/ICPADM.2000.875715
  • Filename
    875715