DocumentCode :
3581854
Title :
Recent progress of advanced microwave and system-in-package integration technologies at National Taiwan University
Author :
Wang, Huei ; Wu, Tzong-Lin ; Hsu, Powen ; Wu, Ruey-Beei ; Lin, Kun-You ; Huang, Tain-Wei
Author_Institution :
Dept. of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan, 10617, ROC
fYear :
2014
Firstpage :
640
Lastpage :
642
Abstract :
This paper describes the recent research accomplishments on advance microwave/millimeter-wave (MMW) and system-in-packaging (SiP) technologies at National Taiwan University (NTU). The scope of our researches includes passive elements, monolithic microwave integrated circuits (MMICs), MMW SiP integration techniques, electromagnetic compatibility (EMC), and system integrations. Significant results have been achieved.
Keywords :
Antennas; Decision support systems; Electrical engineering; Microwave circuits; Microwave communication; EMC; MMICs; SiP; passive components;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference (APMC), 2014 Asia-Pacific
Type :
conf
Filename :
7067863
Link To Document :
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