DocumentCode
3581854
Title
Recent progress of advanced microwave and system-in-package integration technologies at National Taiwan University
Author
Wang, Huei ; Wu, Tzong-Lin ; Hsu, Powen ; Wu, Ruey-Beei ; Lin, Kun-You ; Huang, Tain-Wei
Author_Institution
Dept. of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan, 10617, ROC
fYear
2014
Firstpage
640
Lastpage
642
Abstract
This paper describes the recent research accomplishments on advance microwave/millimeter-wave (MMW) and system-in-packaging (SiP) technologies at National Taiwan University (NTU). The scope of our researches includes passive elements, monolithic microwave integrated circuits (MMICs), MMW SiP integration techniques, electromagnetic compatibility (EMC), and system integrations. Significant results have been achieved.
Keywords
Antennas; Decision support systems; Electrical engineering; Microwave circuits; Microwave communication; EMC; MMICs; SiP; passive components;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference (APMC), 2014 Asia-Pacific
Type
conf
Filename
7067863
Link To Document