DocumentCode
3582351
Title
Modeling of faulty implantable MEMS pressure sensors
Author
Miguel, J.A. ; Lechuga, Y. ; Martinez, M. ; Bracho, S.
Author_Institution
Microelectron. Eng. Group, Univ. of Cantabria, Santander, Spain
fYear
2014
Firstpage
80
Lastpage
83
Abstract
Implantable biomedical devices generally comprise MEMS-type sensors used to acquire physiological signals, as well as CMOS electronics to perform powering, signal conditioning and data transmission. Among their requirements, reliability over an extended period of time ought to be spotlighted. Thus, modeling and realistic fault injection is essential to improve their long-term results. This work targets the development of a fault model for MEMS capacitive pressure sensors, to be part of smart stents with arterial blockage detection capabilities. The deflection profile of circular and square-shaped diaphragms under fault-free conditions has been analytically modeled. However, analytical models are inaccurate to describe the behavior of diaphragms under faulty conditions, which alter the geometry or material properties of the sensor. In these cases, the use of FE analysis tools is necessary to build a realistic fault model library, together with a comprehensive MEMS testing approach.
Keywords
CMOS integrated circuits; biomedical electronics; biomedical transducers; blood vessels; diaphragms; fault diagnosis; finite element analysis; microsensors; neurophysiology; pressure sensors; prosthetics; signal conditioning circuits; CMOS electronics; FE analysis; MEMS testing approach; arterial blockage detection; circular shaped diaphragm; data transmission; fault free conditions; fault injection; fault model library; faulty implantable MEMS capacitive pressure sensor modeling; implantable biomedical device; physiological signal; signal conditioning; smart stents; square shaped diaphragm; Analytical models; Capacitive sensors; Intelligent sensors; Iron; Mathematical model; Micromechanical devices; Biomedical electronics; MEMS testing; biomedical transducers; cardiology; implantable biomedicaldevices;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics (ICM), 2014 26th International Conference on
Type
conf
DOI
10.1109/ICM.2014.7071811
Filename
7071811
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