Code compilation exploration for thermal dissipation reduction in SoC

The ever increasing transistor integration density has allowed the design of complex and powerful system-on-chips (SoC). As consequence, the power consumption density increased significantly, which is directly converted into heat. These two results have a negative impact on the performance and reliability of these SoC. Thermal dissipation is an important factor that might significantly degrade the reliability and lifetime of the SoC. Traditionally, thermal problems are solved by employing advanced packaging and cooling solutions. However, the modern high-performance of the SoC is already pushing the limits of what the cooling solutions can provide. In this way, software solution can be the key of this problem. In this paper, we propose a new method to control and reduce thermal dissipation by profiling and optimizing the application source code.