• DocumentCode
    3582389
  • Title

    Series resistances impacts on full-printed organic circuits

  • Author

    Sankhare, M.A. ; Bergeret, E. ; Pannier, P. ; Coppard, R.

  • Author_Institution
    IM2NP, IMT-Technopole de Chateau-Gombert, Marseille, France
  • fYear
    2014
  • Firstpage
    236
  • Lastpage
    239
  • Abstract
    Impacts of the series resistances scattering in fullprinted organic circuits manufacturing process is studied in this work. The modeling was done by using the well-known Amorphous-Silicon Hydrogenated Thin Film Transistor (A-Si: H TFT) model initially planned for Amorphous Thin Film Transistors. Extractions methods dedicated to this model were applied to organic thin film transistors (OTFTs) using an automatic procedure. This extraction procedure including all above-threshold parameters was applied to a sample of N-type and P-type organic transistors. It then appeared a non-negligible process dispersion correlated and fitted with ideal statistic model. Afterwards, these statistic models are integrated to model cards in order to achieve Monte-Carlo simulations, thus permitting to evaluate the impact of series resistances on full-printed organic circuits. An organic inverter was chosen as example to do the study.
  • Keywords
    Monte Carlo methods; elemental semiconductors; organic semiconductors; printed circuits; silicon; thin film transistors; Monte-Carlo simulations; N-type organic transistors; OTFT; P-type organic transistors; Si; a-Si H TFT model; amorphous-Silicon hydrogenated thin film transistor; extractions methods; fullprinted organic circuits manufacturing process; organic inverter; organic thin film transistors; series resistances scattering; statistic models; Dispersion; Integrated circuit modeling; Organic thin film transistors; Semiconductor device modeling; Solid modeling; A-Si: H TFT; Monte-Carlo; OTFT; process dispersion; series resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics (ICM), 2014 26th International Conference on
  • Type

    conf

  • DOI
    10.1109/ICM.2014.7071850
  • Filename
    7071850