DocumentCode
358273
Title
Dielectric breakdown probabilities for uniform field gap in vacuum
Author
Shioiri, Tetsu ; Kamikawaji, Tom ; Yokokura, Kunio ; Kaneko, Eiji ; Ohshima, Iwao ; Yanabu, Satoru
Author_Institution
Toshiba Corp., Tokyo, Japan
Volume
1
fYear
2000
fDate
2000
Firstpage
17
Abstract
To investigate the reliability of the insulation of equipment having vacuum incorporated as an insulation medium, a study was carried out to clarify breakdown probability distributions in the vacuum gap. Experiments were carried out to investigate the effects of test methods, electrode area, and electrode materials on the breakdown probability distributions of uniform-field gaps. The test results show that the breakdown probability distribution of the vacuum gap can be represented by a Weibull distribution using a location parameter, which shows the voltage that permits a zero breakdown probability. When aiming for highly reliable vacuum insulation equipment, an important factor is insulation design with the location parameter just mentioned taken into account. The location parameter depends on electrode area. This is probably because the existence probability of factors as weakpoints for breakdowns such as micro-protrusions and micro-particles depends on the electrode area
Keywords
Weibull distribution; electrodes; reliability; vacuum breakdown; vacuum insulation; Weibull distribution; breakdown probability distributions; dielectric breakdown probabilities; electrode area; electrode materials; equipment insulation; insulation design; location parameter; micro-particles; micro-protrusions; reliability; uniform field gap; uniform-field gaps; vacuum gap; vacuum insulation; Breakdown voltage; Dielectric breakdown; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Light scattering; Probability distribution; Shape; Vacuum breakdown; Weibull distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum, 2000. Proceedings. ISDEIV. XIXth International Symposium on
Conference_Location
Xi´an
Print_ISBN
0-7803-5791-4
Type
conf
DOI
10.1109/DEIV.2000.877238
Filename
877238
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