• DocumentCode
    358273
  • Title

    Dielectric breakdown probabilities for uniform field gap in vacuum

  • Author

    Shioiri, Tetsu ; Kamikawaji, Tom ; Yokokura, Kunio ; Kaneko, Eiji ; Ohshima, Iwao ; Yanabu, Satoru

  • Author_Institution
    Toshiba Corp., Tokyo, Japan
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    17
  • Abstract
    To investigate the reliability of the insulation of equipment having vacuum incorporated as an insulation medium, a study was carried out to clarify breakdown probability distributions in the vacuum gap. Experiments were carried out to investigate the effects of test methods, electrode area, and electrode materials on the breakdown probability distributions of uniform-field gaps. The test results show that the breakdown probability distribution of the vacuum gap can be represented by a Weibull distribution using a location parameter, which shows the voltage that permits a zero breakdown probability. When aiming for highly reliable vacuum insulation equipment, an important factor is insulation design with the location parameter just mentioned taken into account. The location parameter depends on electrode area. This is probably because the existence probability of factors as weakpoints for breakdowns such as micro-protrusions and micro-particles depends on the electrode area
  • Keywords
    Weibull distribution; electrodes; reliability; vacuum breakdown; vacuum insulation; Weibull distribution; breakdown probability distributions; dielectric breakdown probabilities; electrode area; electrode materials; equipment insulation; insulation design; location parameter; micro-particles; micro-protrusions; reliability; uniform field gap; uniform-field gaps; vacuum gap; vacuum insulation; Breakdown voltage; Dielectric breakdown; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Light scattering; Probability distribution; Shape; Vacuum breakdown; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 2000. Proceedings. ISDEIV. XIXth International Symposium on
  • Conference_Location
    Xi´an
  • Print_ISBN
    0-7803-5791-4
  • Type

    conf

  • DOI
    10.1109/DEIV.2000.877238
  • Filename
    877238