• DocumentCode
    358306
  • Title

    Arc discharges with gas-impregnated cathodes in vacuum

  • Author

    Shkol´nik, S.M.

  • Author_Institution
    A.F. Ioffe Physicotech. Inst., Acad. of Sci., St. Petersburg, Russia
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    168
  • Abstract
    The paper reflects the condition of research into the vacuum arc with such an impregnation of a cathode with hydrogen that the average share of each atom of metal is roughly one H atom. The introductory sections discuss in brief the basic characteristics of the Me-H system and techniques of impregnation of different metals with H. The subsequent sections present the results of investigations of cathode spot parameters and arc characteristics at various Ti cathode impregnation degree. A comparison with characteristics of degassed cathodes demonstrated marked differences: at impregnation of a cathode with H, the velocity of cathode spot motion grows, the current per spot falls off, erosion diminishes; the high-current arc burns steadily and at a lower voltage; the current, critical for anode spot formation, grows significantly. The results given show that the use of H-impregnated cathodes can prove promising for various applications
  • Keywords
    cathodes; hydrogen; titanium; vacuum arcs; wear; H; H-impregnated cathodes; Ti; Ti cathode impregnation degree; anode spot formation current; arc characteristics; arc discharges; cathode spot motion velocity; cathode spot parameters; current per spot; degassed cathodes; erosion reduction; gas-impregnated cathodes; high-current arc burning; metal-H system; vacuum; vacuum arc; Arc discharges; Cathodes; Electrodes; Fault location; Hydrogen; Magnetic materials; Plasma devices; Plasma properties; Plasma temperature; Vacuum arcs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 2000. Proceedings. ISDEIV. XIXth International Symposium on
  • Conference_Location
    Xi´an
  • Print_ISBN
    0-7803-5791-4
  • Type

    conf

  • DOI
    10.1109/DEIV.2000.877278
  • Filename
    877278